Intel's 10nm processor dubbed Snow Ridge, likely to be the next generation Xeon D

Posted by Paul Braren on Jan 10 2019 (updated on Jan 17 2019) in
  • CPU
  • IoT
  • XeonD-2100
  • Not a lot of new CPU news came out of CES that directly relates to ship dates for 10nm successors to the popular-with-home-labs 14nm Xeon D-1500 and Xeon D-2100 lines. What surfaced were tweets about stop-gap designs, and a bit of speculation.

    How long before we see systems and motherboards based on next-generation 10nm designs? It seems likely we're at least a year away from seeing solutions announced, and a few months later for them to be available in volume in the marketplace.

    As you know, I'm always on the lookout for new TinkerTry'd Bundle designs, including hands-on testing of the 8 core Intel Xeon D-2146NT happening soon. I'll certainly be keeping an eye out for more information.

    Meanwhile, read onward for a bit of information that just became available.

    intels-keynote-at-ces-2019-10nm-ice-lake-lakefield-snow-ridge-cascade-lake
    • Intel’s Keynote at CES 2019: 10nm, Ice Lake, Lakefield, Snow Ridge, Cascade Lake
      Jan 07 2019 by Ian Cutress at AnandTech
      Snow Ridge on 10nm: An SoC for Networking and 5G (Next-Gen Xeon-D?)

      ...
      The Data Center Group will be making two specific announcements around 10nm. The first is disclosing the Snow Ridge family of processors, focused on networking and specifically targeting the wide array of 5G deployments coming up over the next decade.
      ...

      Intel gave no other details, however going back in my mind, I realise that we’ve heard this before with Intel. They already have processors on their roadmap focused specifically on networking, with 40 GbE support and features like QuickAssist Technology to accelerate networking cryptography: the Xeon-D line of processors. This makes me believe that Snow Ridge will be the name for the next generation of Xeon D, either the Xeon D-2500 or Xeon D-3100, depending on the power envelope Intel is going for.

      Given this assumption, and the fact that Intel has said that this is a 10nm processor, I suspect we’re looking at a multi-core Sunny Cove enterprise design with integrated networking MACs and support for lots of storage and lots of ECC memory. There’s an outside chance that it might support Optane, allowing for bigger memory deployments, although I wouldn’t put money on it at this stage.
      ...

    Here's a French site called GNT, calling out Ian's article.

    intel-snow-ridge-5g-station-antenne-edge-computing-actualite-1960885

    photo-thumbnail-courtesy-of-GNT
    Image thumbnail courtesy of GNT.

    Visit the source article to also view the screenshot gallery.

    According to this article:

    38365

    See also at TinkerTry

    All Xeon D, and just the Xeon D-2100 articles.

    new-supermicro-superserver-sys-e300-9d-models-announced

    See also

    intel-lakefield
    • Intel Lakefield Brings Its 3D Chip-Stacking Tech to Life
      Jan 07 2019 by Brian Barrett at Wired

      "We were thinking out into the next decade," says Gomes, a 22-year Intel veteran. "How should products be built?"

      INTEL
      They landed on what would become Foveros, a 3D packaging technology that stacks logic chips atop one another. Monday at CES, that design became an actual product: Lakefield, a breakthrough CPU architecture tailor-made for devices that don't yet exist.

    intel-lakefield-foveros-3d-chip-stacking-soc-design-ces-2019
    • Intel demos first Lakefield chip design using its 3D stacking architecture
      The Foveros era at Intel is approaching

      Jan 07 2019 by Nick Statt at The Verge

      Intel is making progress on developing its next-generation 10-nanometer processors, and today during its CES press conference, the chipmaker showed off the first completed designs for what the company is calling Lakefield. Based on the Foveros 3D design that was first outlined last month, Lakefield is effectively a stacked processor, similar to how chipmakers can now stack memory, that lets Intel break out different PC components into separate “chiplets” that rest on top of one another to create a full system-on-a-chip.

      The benefits of stacking are that you can make something small — in this case, an entire computer board that’s no bigger than five quarters laid end to end.